Glenn R. Blackwell0849385911, 9780849385919
Table of contents :
Organization……Page 3
Contributors……Page 5
Contents……Page 6
Appendex A: Definitions……Page 0
1.2.1 Introduction……Page 9
1.2.2 The Process View of Production……Page 12
Quality Function Deployment……Page 13
1.3.2 Systems Engineering Theory and Concepts……Page 15
Functional Analysis……Page 16
Synthesis……Page 17
Evaluation and Decision……Page 18
Description of System Elements……Page 20
Design Development……Page 21
Electronic System Design……Page 23
Budget Requirements Analysis and Project Proposal……Page 26
Project Management……Page 27
Time Control of the Project……Page 29
1.4 Quality Concepts……Page 30
1.4.1 Design of Experiments……Page 32
Multivari Chart……Page 33
Components Search……Page 34
Variables Search……Page 36
Full Factorial Analysis……Page 37
Realistic Tolerances Parallelogram Plots……Page 38
Precontrol……Page 39
1.5.1 Introduction……Page 40
1.5.2 Computers and Types of Documentation……Page 41
Axiomatic Theory of Design……Page 43
Design Guidelines……Page 44
1.7.1 Introduction and Definitions……Page 45
Registration, Europe……Page 46
Registration, U.S.A…….Page 47
1.7.4 Implementation: Process Flow……Page 48
Third Stage……Page 49
Fourth Stage……Page 50
Benefits of ISO 9000……Page 51
1.7.7 ISO 9000 Summary……Page 52
1.9 Reference and Standards Organizations……Page 53
References……Page 55
2.2 SMT Overview……Page 57
2.2.1 SMT Design, Assembly, and Test Overview……Page 58
2.3 Surface Mount Device (SMD) Definitions……Page 62
2.4 Substrate Design Guidelines……Page 64
2.5 Thermal Design Considerations……Page 66
2.6 Adhesives……Page 68
2.6.1 Adhesive Characteristics……Page 69
Failure Characteristics during Rework……Page 70
2.6.2 Adhesive Application Techniques……Page 71
Pin-Transfer……Page 72
2.6.3 Dot Characteristics……Page 73
2.6.4 Adhesive Process Issues……Page 75
2.6.5 Adhesives for Thermal Conduction……Page 76
Dielectric Strength, in Volts/Mil……Page 77
Color……Page 78
2.6.6 Electrically Conductive Adhesives……Page 79
2.6.7 Adhesives for Other Purposes……Page 80
2.7.1 Solderability……Page 81
2.7.2 Flux……Page 83
Flux Application……Page 84
2.7.3 Solder Paste……Page 85
2.7.4 Paste-In-Hole Technology……Page 87
2.8.2 Moisture Sensitivity of Plastic Packages……Page 88
2.8.3 Part Placement……Page 90
2.9 Reflow Soldering……Page 93
Post-Reflow Inspection……Page 95
2.11 Prototype Systems……Page 96
Terms and Definitions……Page 97
References……Page 98
Other Sources……Page 99
Conferences Directly Related to SMT……Page 100
4.1 Introduction……Page 102
4.3 Known Good Die……Page 103
4.4 Chip on Board……Page 104
4.5.1 Flip Chip Overview……Page 105
Introduction……Page 108
Flip Chip Benefits……Page 109
The Solder Joint……Page 110
Flip Chip Solder Bump Deposition Processes……Page 111
Benefits and Drawbacks of Printed Solder Bumps……Page 118
Flip Chip Handling and Placement Equipment……Page 121
Fluxes and Underfills……Page 122
Acknowledgments……Page 125
4.6 Chip-Scale Packages……Page 126
Bibliography……Page 128
5.1 Introduction……Page 130
5.2.1 Board Types, Materials, and Fabrication……Page 131
5.2.2 Design of Printed Wiring Boards……Page 135
5.2.3 PWB Interconnection Models……Page 137
References……Page 144
5.3 Basic Circuit Board Design: Overview and Guidelines……Page 145
5.4 Prototyping……Page 146
5.5 DFM and DFT Issues……Page 147
5.6.1 Board Warpage……Page 150
5.6.2 Board Surface Finishes……Page 151
5.7.1 Grounds……Page 152
Analog Design……Page 153
Digital Design……Page 154
5.8 Simulation……Page 155
5.9.1 Institute for Interconnecting and Packaging Electronic Circuits (IPC)……Page 156
Military……Page 157
References……Page 158
EMC and Printed Circuit Board Design……Page 160
6.1.1 Hidden RF Characteristic of Passive Components……Page 161
Resistors……Page 163
Transformers……Page 164
6.1.2 How and Why RF Energy is Created Within the PCB……Page 165
6.1.3 Concept of Flux Cancellation (Flux Minimization)……Page 169
6.1.4 Common-Mode and Differential-Mode Currents……Page 170
Common-Mode Currents……Page 171
6.1.5 RF Current Density Distribution……Page 174
6.1.6 Skin Effect and Lead Inductance……Page 175
6.1.7 Grounding Methods……Page 177
Single-Point Grounding……Page 178
Multipoint Grounding……Page 179
6.1.8 Ground And Signal Loops (Excluding Eddy Currents)……Page 180
6.1.9 Aspect Ratio—Distance Between Ground Connections……Page 181
6.1.10 Image Planes……Page 182
6.1.11 Slots in an Image Plane……Page 184
6.1.12 Partitioning……Page 185
Fundamental Principles……Page 187
Fundamental Concepts……Page 188
Section 6.1 References……Page 189
6.2.1 Overview on Transmission Lines……Page 190
Microstrip Topology……Page 191
Embedded Microstrip Topology……Page 193
Single Stripline Topology……Page 194
Dual or Asymmetric Stripline Topology……Page 195
Differential Microstrip and Stripline Topology……Page 197
6.2.3 Relative Permittivity (Dielectric Constant)……Page 198
6.2.4 Capacitive Loading of Signal Traces……Page 201
Section 6.2 References……Page 202
6.3.1 Impedance Matching—Reflections and Ringing……Page 203
6.3.2 Calculating Trace Lengths (Electrically Long Traces)……Page 206
Example……Page 207
6.3.3 Routing Layers……Page 208
6.3.4 Layer Jumping—Use of Vias……Page 209
6.3.5 Trace Separation and the 3-W Rule……Page 210
6.3.6 Trace Termination……Page 211
6.3.7 Series Termination……Page 214
6.3.9 Parallel Termination……Page 215
6.3.10 Thevenin Network……Page 216
6.3.11 RC Network……Page 217
6.3.12 Diode Network……Page 218
Section 6.3 References……Page 219
6.4.1 Review of Resonance……Page 220
Series Resonance……Page 221
Impedance……Page 222
Energy Storage……Page 224
6.4.3 Resonance……Page 225
6.4.4 Power and Ground Planes……Page 227
6.4.5 Capacitors in Parallel……Page 228
6.4.6 Power and Ground Plane Capacitance……Page 230
6.4.7 Buried Capacitance……Page 233
6.4.9 Lead-Length Inductance……Page 234
Decoupling Capacitors……Page 235
6.4.12 Calculating Capacitor Values (Wave-Shaping)……Page 239
Method 2……Page 241
6.4.13 Selection of Bulk Capacitors……Page 242
Method 1……Page 243
6.4.14 Designing a Capacitor Internal to a Component’s Package……Page 244
6.4.15 Vias and Their Effects in Solid Power Planes……Page 246
Additional Bibliography/Suggested Readings……Page 247
7.2 Ceramic Substrates……Page 250
Functional Materials……Page 251
Binder……Page 253
7.3.2 Screen Printing……Page 254
7.4.1 Deposition……Page 255
7.4.2 Materials……Page 256
7.5 Chip Resistors and Multilayer Ceramic Capacitors……Page 257
7.6 Component and Assembly Packages……Page 258
7.7 Buried Passive Circuit Elements……Page 259
7.8.2 Tape Automated Bonding……Page 260
7.9.1 Multichip Module Technology Definitions……Page 261
7.9.2 Design, Repair, and Test……Page 267
7.9.3 When to Use Multichip Modules……Page 269
7.9.4 Issues in the Design of Multichip Modules……Page 271
References, Sections 7.1–7.8……Page 272
Suggested Readings……Page 273
Where Else?……Page 276
8.1.2 Crosstalk……Page 277
8.2 Wires for Interconnection……Page 278
8.3.2 Terminals for Wire Connections……Page 279
8.4.1 Electrical Considerations……Page 280
8.4.2 Mechanical Considerations……Page 281
8.4.4 Contact Types……Page 284
8.5 Board Interconnects……Page 285
8.6.1 Socket Types……Page 286
8.6.3 Socket Selection……Page 288
8.6.4 Examples of Specific Socket Types……Page 290
8.7.1 Basic Principle of Operation……Page 291
Absorbtion……Page 294
Chromatic Dispersion……Page 295
Fiber Types……Page 297
Fiber Nonlinearities……Page 299
Stimulated Brillouin Scattering (SBS)……Page 300
Four Wave Mixing……Page 301
8.7.3 Fiber Manufacturing……Page 302
Cable Design Considerations……Page 304
Central Member……Page 305
Tensile Strength Elements……Page 306
Slotted Rod……Page 307
Sheath Options……Page 308
Armoring Options……Page 309
Self-Supporting Aerial Cables……Page 310
Applications/Considerations of Outdoor Cables……Page 311
Outdoor Installations……Page 312
National Electrical Code……Page 313
Tight Buffered Premises Cables: General Construction and Overview……Page 314
Loose Tube Premises Cables—General Construction and Overview……Page 315
900-µm Tight Buffer Material……Page 316
Applications of Cables……Page 317
Industrial-Use Cables……Page 318
Fusion Splicing……Page 319
Optical Fiber Tests……Page 320
Attenuation……Page 321
8.7.7 Defining Terms……Page 323
8.8.2 General Applications……Page 324
8.8.3 Theory……Page 325
8.8.4 Power Handling……Page 326
8.8.5 Short Interconnection Applications……Page 328
8.8.7 Intermodulation Products……Page 329
8.8.8 Long Interconnection Applications……Page 330
8.8.9 Defining Terms……Page 331
8.9.2 Characterization of Passive Elements……Page 332
8.9.3 Transmission Line Sections……Page 334
8.9.5 Impedance Transformers……Page 335
8.9.8 Microwave Resonators……Page 336
8.9.9 Tuning Elements……Page 337
8.9.10 Hybrid Circuits and Directional Couplers……Page 338
8.9.11 Filters……Page 339
Circulators and Isolators……Page 340
Suggested Readings……Page 341
References……Page 342
9.2 Testing Philosophies……Page 344
9.2.2 Loaded Board Tests……Page 345
9.3 Scan Test for Digital Devices……Page 347
9.3.1 Boundary Scan Defined……Page 348
TAP State Diagram……Page 350
Test Access Port Operation Modes……Page 351
Software Comands……Page 353
TAP Hardware……Page 354
9.3.3 Boundary-Scan Register Cells……Page 355
9.3.5 Support Software……Page 357
9.4 General Electrical Design……Page 358
9.4.1 General Data Acquisition Considerations……Page 360
9.5.1 Design for Bed-of-Nails Fixtures……Page 361
9.5.2 Design for Flying Probe Testers……Page 365
Definitions and Acronyms……Page 366
References……Page 367
10.1 Introduction……Page 369
10.2.2 Cure Properties……Page 370
10.3 General Classification of Adhesives……Page 371
10.4.1 Epoxy Adhesives……Page 372
10.5.1 Electrically Conductive Adhesives……Page 373
Anisotropic Electrically Conductive Adhesives……Page 374
10.5.2 Thermally Conductive Adhesives……Page 375
10.6 Adhesive Application Methods……Page 376
10.6.2 Pin Transfer……Page 377
10.6.3 Syringing……Page 378
10.7.1 Thermal Cure……Page 381
Thermal Cure Profile and Bond Strength……Page 382
Adhesive Cure Profile and Flux Entrapment……Page 384
10.8 Evaluation of Adhesives with Differential Scanning Calorimetry……Page 387
10.8.1 Basic Properties of DSC Analysis……Page 389
10.8.2 DSC Characterization of an Epoxy Adhesive……Page 390
10.8.3 DSC Characterization of an Acrylic Adhesive……Page 392
10.9 Summary……Page 393
References……Page 394
11.2 Overview……Page 398
11.3.2 Heat Capacity……Page 400
11.3.6 Solids……Page 401
11.3.9 Melting Point……Page 402
11.4.3 Temperature Compensation……Page 403
Basic Heat Flow Relations, Data for Heat Transfer Modes……Page 405
11.6 Heat Removal/Cooling in the Design of Packaging Systems……Page 413
Enhanced Packages……Page 414
Natural Convective Removal……Page 415
Heat Sink Compounds……Page 417
Forced Convective Removal……Page 418
Example……Page 420
Conductive Removal to Standard Board/Substrate……Page 421
Conductive Removal to Enhanced Board/Substrate……Page 422
References……Page 423
12.2 Testing Philosophies……Page 425
12.2.1 Types of testing……Page 426
12.4 Sources of Faults……Page 428
12.4.1 Component Faults……Page 429
12.4.3 Performance Faults……Page 431
12.4.5 Fault Distributions……Page 432
12.5 Automated Test Methods……Page 433
12.5.2 PC-Based Testing……Page 434
12.5.5 In-Circuit Analyzer……Page 435
12.5.6 In-Circuit Testing……Page 436
12.5.8 Substitution Testing……Page 437
12.5.10 Fault Coverage……Page 438
12.6.2 BON Test Points……Page 439
12.7 Environmental Stress Screening……Page 440
12.8 Test Software……Page 443
12.9 Testing Software Programs……Page 444
12.9.2 Software Code and Unit Test……Page 445
12.9.5 System Verification Test—Main Phase……Page 448
Engineering Field Trial—Selection of Site……Page 450
Engineering Field Trial—Bring Up the System and Dry Run……Page 451
Engineering Field Trial—Execute Field Trial Plan……Page 452
12.9.8 Customer Acceptance Process (Beta Test)……Page 453
System Verification Test—Final Test……Page 454
Defining Terms……Page 455
Abbreviations……Page 456
References……Page 457
13.1 Introduction……Page 460
13.2 General Inspection Criteria……Page 461
Off-Line Inspection……Page 463
13.4 Solder Joint Inspection Criteria……Page 464
Solder Bridges……Page 465
Solder Balls……Page 466
13.5 Visual Inspection……Page 467
2-D X-Ray……Page 469
References……Page 470
14.2 Ergonomic Considerations……Page 472
14.3.2 Introduction……Page 473
A1.1 Control Selection……Page 474
A1.1.2 Control-Effect Relationships……Page 475
A1.1.3 Standard Practices……Page 477
Keylock…….Page 478
Detent thumbwheel…….Page 479
Pushbutton…….Page 480
Legend switch…….Page 481
Rocker switch…….Page 483
A1.3 Sets of Numerical Keys……Page 485
Application 14.2 Keys……Page 486
Light signals…….Page 500
Crank…….Page 488
Lever…….Page 489
A3.1 Computer Input Devices……Page 492
A4.1 Coding……Page 494
A4.2 Preventing Accidental Activation……Page 497
A4.3 Displays……Page 498
Complex displays…….Page 501
14.3.4 Electronic Displays……Page 504
Example……Page 505
Application 14.5……Page 506
A5.2 Control-Display Assignments……Page 507
A5.4 Auditory Signals……Page 509
A5.5.1 Labels……Page 510
A5.5.2 Warnings……Page 511
14.3.6 Challenges……Page 512
14.4 Environmental Issues……Page 513
14.5 Maintenance……Page 514
14.6 Safety……Page 515
References……Page 516
15.1 Introduction……Page 518
15.2 Reliability……Page 520
15.2.1 Basic Reliability Concepts……Page 521
Example 15.1……Page 524
15.2.2 Accelerated Testing……Page 525
15.3 Micromechanisms of Failure in Electronic Packaging Materials……Page 526
Example 15.3……Page 527
Brittle Overload……Page 528
Example 15.4……Page 530
15.3.2 Time-Dependent, Progressive Failure……Page 531
Fatigue Crack Growth……Page 532
Example 15.5……Page 533
15.4.1 Solder Joint Reliability……Page 534
15.4.2 Wirebond Reliability……Page 537
Example 15.6……Page 540
15.4.4 Semiconductor Devices……Page 541
15.5 Failure Analyses of Electronic Packages……Page 542
15.6 Thermal Management……Page 544
Example 15.7……Page 545
15.7 Concluding Remarks……Page 549
References……Page 550
16.1.1 Safety Philosophy of Electronic Equipment……Page 555
Electric Shock and Energy Hazard……Page 556
Heat, Fire, and Tracking Hazards……Page 557
Sonic and Ultrasonic Pressure Hazards……Page 558
Ergonomics Hazards……Page 559
16.1.3 International Regulations Mandating Product Safety……Page 560
16.1.4 Standards……Page 561
16.1.5 Criteria for Compliance, Required Documentation……Page 562
16.2.1 Risk Management……Page 563
16.2.2 Safety and EMC Tests……Page 566
Mechanical Tests……Page 567
Leakage Currents……Page 568
Equipment Used for Safety Tests……Page 569
Radio Frequency Interference and Immunity……Page 570
Other EMC Tests……Page 571
16.3.1 Selection of Components……Page 572
Power Supply Cord Set……Page 574
Fuses/Fuseholders……Page 575
Switches……Page 576
Appliance Inlet, Line Filters, Capacitors, Resistors, Transient Voltage Surge Suppressors, and Po………Page 577
Thermoplastic Materials……Page 578
16.3.2 Construction Details……Page 579
Enclosures……Page 580
Earthing (Grounding)……Page 581
16.3.4 Marking Requirements……Page 582
16.3.5 Documentation Requirements……Page 583
16.4.1 CE Marking……Page 585
16.4.1.1 Procedure for CE Marking……Page 586
Low Voltage Directive……Page 587
Medical Devices Directive……Page 588
16.4.2 UL Mark……Page 589
16.4.3 Reciprocal Certification Scheme……Page 590
Mutual Recognition Agreements……Page 591
16.5 Appendix……Page 592
Base Material……Page 595
Chip-and-Wire……Page 596
Conductor……Page 597
DIPs……Page 598
Fault Simulation……Page 599
Header (Connector)……Page 600
Laser Trimming……Page 601
Multichip Integrated Circuit……Page 602
Printed Board Assembly……Page 603
Socket Contact……Page 604
TCP……Page 605
µ……Page 606
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