11.Components, Packaging, and Manufacturing Technology

John G. Webster (Editor)

Table of contents :
Local Disk……Page 0
11• Components, Packaging, and Manufacturing Technology……Page 1
Abstract……Page 2
Channel Capacity……Page 4
Abstract……Page 26
Circuit Analysis Computing of Semiconductor Packages and Systems……Page 28
Abstract……Page 41
Encapsulation Materials and Processes……Page 43
Abstract……Page 55
Environmentally Sound Assembly Processes……Page 57
Abstract……Page 68
Known Good Die Technology……Page 70
Abstract……Page 82
Multichip Modules……Page 84
Abstract……Page 95
Packaging of Optical Components and Systems……Page 97
Abstract……Page 115
Packaging Reliability, Chip-Scale Semiconductor……Page 117
Abstract……Page 151
Packaging RF Devices and Modules……Page 153
Abstract……Page 177
Printed Wiring Board Technology……Page 179
Abstract……Page 197
Surface Mount Technology……Page 199
Abstract……Page 209
System Interconnects……Page 211
Abstract……Page 222
Thermal Analysis and Design of Electronic Systems……Page 224