Reliability and Failure of Electronic Materials and Devices

Milton Ohring0-12-524985-3, 0-12-524985-3, 978-0-12-524985-0

Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects–their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise. Key Features * Discusses reliability and failure on both the chip and packaging levels * Handles the role of defects in yield and reliability * Includes a tutorial chapter on the mathematics of reliability * Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints * Considers defect detection methods and failure analysis techniques

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Table of contents :
Reliability and Failure of Electronic Materials and Devices……Page 4
Copyright Page……Page 5
Contents……Page 8
Acknowledgments……Page 18
Preface……Page 20
1.1 Electronic Products……Page 24
1.2 Reliability, Other “… ilities,” and Definitions……Page 36
1.3 Failure Physics……Page 40
1.4 Summary and Perspective……Page 54
Exercises……Page 55
References……Page 58
2.1 Introduction……Page 60
2.2 Electronic Materials……Page 61
2.3 Diodes……Page 76
2.4 Bipolar Transistors……Page 82
2.5 Field Effect Transistors……Page 85
2.6 Memories……Page 97
2.7 GaAs Devices……Page 102
2.8 Electro-optical Devices……Page 107
2.9 Processing—The Chip Level……Page 114
Exercises……Page 123
References……Page 125
3.1 Scope……Page 128
3.2 Defects in Crystalline Solids and Semiconductors……Page 130
3.3 Processing Defects……Page 148
3.4 Contamination……Page 164
3.5 Yield……Page 178
Exercises……Page 191
References……Page 194
4.1 Introduction……Page 198
4.2 Statistics and Definitions……Page 200
4.3 All About Exponential, Lognormal and Weibull Distributions……Page 207
4.4 System Reliability……Page 225
4.5 On the Physical Significance of Failure Distribution Functions……Page 231
4.6 Prediction Confidence and Assessing Risk……Page 245
4.7 A Skeptical and Irreverent Summary……Page 252
Exercises……Page 254
References……Page 258
5.1 Introduction……Page 260
5.2 Diffusion and Atom Movements in Solids……Page 261
5.3 Binary Diffusion and Compound Formation……Page 265
5.4 Reactions at Metal–Semiconductor Contacts……Page 271
5.5 Electromigration Physics and Damage Models……Page 282
5.6 Electromigration in Practice……Page 296
5.7 Stress Voiding……Page 307
5.8 Failure of Incandescent Lamps……Page 316
Exercises……Page 319
References……Page 323
6.1 Introduction……Page 326
6.2 Aspects of Conduction in Insulators……Page 327
6.3 Dielectric Breakdown……Page 333
6.4 Hot-Carrier Effects……Page 353
6.5 Electrical Overstress and Electrostatic Discharge……Page 362
Exercises……Page 375
References……Page 378
7.1 Introduction……Page 382
7.2 Atmospheric Contamination and Moisture……Page 383
7.3 Corrosion of Metals……Page 389
7.4 Corrosion in Electronics……Page 396
7.5 Metal Migration……Page 408
7.6 Radiation Damage to Electronic Materials and Devices……Page 414
Exercises……Page 428
References……Page 431
8.1 Introduction……Page 434
8.2 IC Chip-Packaging Processes and Effects……Page 438
8.3 Solders and Their Reactions……Page 458
8.4 Second-Level Packaging Technologies……Page 470
8.5 Thermal Stresses in Package Structures……Page 475
Exercises……Page 490
References……Page 494
9.1 Introduction……Page 498
9.2 The Nature of Contacts……Page 499
9.3 Degradation of Contacts and Connectors……Page 505
9.4 Creep and Fatigue of Solder……Page 515
9.5 Reliability and Failure of Solder Joints……Page 530
9.6 Dynamic Loading Effects in Electronic Equipment……Page 549
Exercises……Page 554
References……Page 558
10.1 Introduction……Page 562
10.2 Failure and Reliability of Lasers and Light-Emitting Diodes……Page 563
10.3 Thermal Degradation of Lasers and Optical Components……Page 582
10.4 Reliability of Optical Fibers……Page 591
Exercises……Page 605
References……Page 608
11.1 Overview of Testing and Failure Analysis……Page 610
11.2 Nondestructive Examination and Decapsulation……Page 615
11.3 Structural Characterization……Page 626
11.4 Chemical Characterization……Page 638
11.5 Examining Devices Under Electrical Stress……Page 644
Exercises……Page 658
References……Page 661
12.1 Introduction……Page 664
12.2 Integrated Circuit Technology Trends……Page 665
12.3 Scaling……Page 677
12.4 Fundamental Limits……Page 681
12.5 Improving Reliabihty……Page 685
Exercises……Page 692
References……Page 694
Appendix……Page 696
Index……Page 698