Introduction to microelectromechanical systems engineering

Nadim Maluf, Kirt Williams1580535909

The introduction is for scientists, engineers, students, and business executives who do not necessarily have any prior experience with what are called MEMS by those who know them intimately, but do have an understanding of basic scientific concepts equivalent to first-year college physics and chemistry. Maluf and Williams, both with technology companies, have revised the original text, for which they cite no date, to incorporate developments in the field, new products, and suggestions from readers of the first edition. While maintaining the approach of describing a selection of demonstrators now available commercially or soon to be, they include more practical hints for applying the technology, and expand the discussion on the fabrication processes, adding new methods and materials

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Table of contents :
TeamLiB……Page 1
Cover……Page 2
Table of Contents……Page 9
Foreword……Page 15
Preface……Page 17
Preface to First Edition……Page 21
The Promise of Technology……Page 23
What Are MEMS or MST?……Page 24
What Is Micromachining?……Page 25
Applications and Markets……Page 26
To MEMS or Not To MEMS?……Page 29
The Psychological Barrier……Page 30
Journals, Conferences, and Web Sites……Page 31
Summary……Page 33
Silicon-Compatible Material System……Page 35
Other Materials and Substrates……Page 43
Important Material Properties and Physical Effects……Page 46
Summary……Page 53
CHAPTER 3 Processes for Micromachining……Page 55
Basic Process Tools……Page 56
Advanced Process Tools……Page 77
Nonlithographic Microfabrication Technologies……Page 85
Combining the Tools Examples of Commercial Processes……Page 90
Summary……Page 96
General Design Methodology……Page 101
Techniques for Sensing and Actuation……Page 103
Passive Micromachined Mechanical Structures……Page 107
Sensors and Analysis Systems……Page 111
Actuators and Actuated Microsystems……Page 138
Summary……Page 150
Imaging and Displays……Page 155
Fiber-Optic Communication Devices……Page 163
Summary……Page 187
Microfluidics for Biological Applications……Page 191
DNA Analysis……Page 194
Microelectrode Arrays……Page 204
Summary……Page 207
Signal Integrity in RF MEMS……Page 211
Passive Electrical Components: Capacitors and Inductors……Page 212
Microelectromechanical Resonators……Page 222
Microelectromechanical Switches……Page 233
Summary……Page 236
CHAPTER 8 Packaging and Reliability Considerations for MEMS……Page 239
Key Design and Packaging Considerations……Page 240
Die-Attach Processes……Page 247
Wiring and Interconnects……Page 249
Types of Packaging Solutions……Page 255
Quality Control, Reliability, and Failure Analysis……Page 265
Summary……Page 278
Glossary……Page 283
About the Authors……Page 293
Index……Page 295