Gerhard Franz (auth.)9783540858485, 3540858482, 9783540858492
This monograph presents an up to date perspective of gas discharge physics and its applications to various industries. It starts from a comprehensive overview of the different types to generate plasmas by DC discharges, capacitive and inductive radiofrequency coupling, helicon waves including electron cyclotron resonance, and ion beams. To compare these theories with inert plasmas, a fundamental description of plasma diagnostics is presented on the basis of four prominent methods and extended to reactive plasmas.The second part extensively deals with the interaction of these plasmas with surfaces in order to coat or to etch them with reactive gases. Main topics are sputtering, plasma-enhanced chemical vapor deposition, and reactive ion etching. The difficulties which had to be overcome to reach the next technological node in the semiconductor map are documented by a long row of microfeatures. These processes and corresponding microscopic mechanisms are discussed in the final section of this part. In the concluding third part, various fundamental derivations are minutely extended which are required for a deep understanding of the plasma processes.
In retrospect, the semiconductor industry has triggered the development of new methods to excite plasmas. But it was now the industrial part to operate these plasmas with reactive gases. As a result of this combined effort, surface modifications with plasmas are now in widespread use even in low-cost applications due to its easy and convenient implantation as well as its favorable environmental impact.
Table of contents :
Front Matter….Pages i-xxii
Introduction….Pages 1-3
Collisions and cross sections….Pages 5-40
The plasma….Pages 41-67
DC discharges….Pages 69-101
High-frequency discharges I….Pages 103-149
High-frequency discharges II….Pages 151-213
High-frequency discharges III….Pages 215-267
Ion beam systems….Pages 269-297
Plasma diagnostics….Pages 299-374
Plasma deposition processes….Pages 375-438
Plasma etch processes….Pages 439-515
Etch Mechanisms….Pages 517-557
Outlook….Pages 559-565
Advanced Topics….Pages 567-659
Back Matter….Pages 1-63
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