Processing of High-Temperature Superconductors at High Strain

A.G. Mamalis, D. E. Manolakos, A. Szalay, G. Pantazopoulos9781566768788, 1566768780

The discovery of high-temperature superconductivity [1986] by Bendnorz and Müller in the La-BA-Cu-O system resulted in very extensive research work about the discovery and synthesis of other high-temperature superconductors, such as Y-BA-Cu-O and Bi-Sr-Ca-Cu-O. These new superconducting materials, possessing superconductivity above liquid nitrogen boiling point, are used in many engineering applications, from electronic sensors to rotating electrical generators and from nanometer-scale thin films to kilometer-long wires and coils. Therefore, design and net-shape manufacturing of superconducting components, starting from the initial synthesized powders, is now of utmost industrial importance.This book is primarily focused on the bulk-fabrication techniques of high-temperature ceramic superconducting components, especially on the combination of dynamic powder-consolidation and subsequent deformation processing. The properties of these ceramics, which are difficult-to-form materials by applying conventional techniques, are combined for the net-shape manufacturing of such components for the construction of HTS devices. However, very important topics such as superconducting structures, chemical synthesis, film fabrication and characterization techniques are also reviewed to provide a complete, comprehensive view of superconductors engineering.

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Table of contents :
Processing of High-Temperature Superconductors at High Strain Rates……Page 1
Table of Contents……Page 3
Foreword……Page 5
Preface……Page 6
1.1 BRIEF HISTORY OF SUPERCONDUCTIVITY……Page 7
Table of Contents……Page 0
1.2 THE STRUCTURE OF THE MONOGRAPH……Page 10
1.3 REFERENCES……Page 12
2.1 NOTATION……Page 14
2.2 BCS THEORY……Page 15
2.3.1 Zero Resistivity……Page 16
2.3.2 Diamagnetic or Meissner Effect……Page 17
LONDON EQUATION—PENETRATION DEPTH……Page 18
INTERMEDIATE STATE……Page 20
2.3.3 Energy Gap……Page 21
2.3.5 Magnetic Flux Quantization……Page 22
2.3.7 Tunneling Effect (Josephson Effect)……Page 23
2.4 REFERENCES……Page 24
3.1 GENERAL……Page 25
3.2.1 La-Ba-Cu-O Cuprate System……Page 26
3.2.2 Y-Ba-Cu-O Cuprate System……Page 27
3.2.3 Bi-Sr-Ca-Cu-O and TI-Ba-Ca-Cu-O Cuprate Systems……Page 29
3.2.4 Hg-Ba-Ca-Cu-O Cuprate System……Page 30
3.3.1 Solid-State Reaction (Ceramic) Method……Page 33
Y-Ba-Cu-O……Page 34
Bi-Sr-Ca-Cu-O……Page 35
Hg-Ba-Ca-Cu-O……Page 36
Y-Ba-Cu-O……Page 37
3.3.3 Sol-Gel Method……Page 38
Bi-Sr-Ca-Cu-O……Page 39
3.3.5 Self-Propagating High-Temperature Synthesis (SHS)……Page 40
3.4 EFFECT OF DOPING ON THE STRUCTURE AND PROPERTIES OF HTS……Page 42
DOPING WITH ALKALI ELEMENTS……Page 43
TUNGSTEN DOPING……Page 44
DOPING WITH VB ELEMENTS……Page 46
3.5.1 General……Page 47
1010 < T < 1300 C……Page 48
840 < T< 860 C (2223 Phase Formation)……Page 49
3.6.2 Superconducting Properties……Page 50
3.7 REFERENCES……Page 51
4.1 NOTATION……Page 54
4.2 GENERAL……Page 56
4.3 DYNAMIC CONSOLIDATION OF POWDERS……Page 57
RECTANGULAR 3D CONFIGURATION……Page 59
CYLINDRICAL SINGLE-TUBE CONFIGURATION……Page 60
CYLINDRICAL DOUBLE-TUBE CONFIGURATION……Page 61
HIGH-TEMPERATURE SETUP……Page 62
4.3.2 Electromagnetic Compaction……Page 63
HUGONIOT CURVES……Page 64
SHOCK WAVE PROFILE……Page 67
Transmission of Shock Wave from Material A to Material B when ZA ZB……Page 68
Transmission of Shock Wave from Material A to Material B when ZA ZB……Page 69
FUNDAMENTAL APPROACH……Page 70
EOS FOR SOLID AND POROUS MATERIALS……Page 74
4.4.3 Thermodynamic Treatment……Page 76
4.4.4 Shock-Induced Energy……Page 79
INTERPARTICLE MELTING MODEL……Page 80
VOID COLLAPSE MODEL……Page 81
FRAGMENTATION MODEL……Page 83
CRACKS……Page 85
DISLOCATIONS……Page 86
COMPACTION/CLADDING OF METAL/HTS/METAL SANDWICH PLATES……Page 89
AXISYMMETRIC EXPLOSIVE COMPACTION OF METAL/HTS/METAL BILLETS……Page 92
Y-Ba-Cu-O……Page 93
Bi-Sr-Ca-Cu-O……Page 94
4.5.2 Compaction/Cladding of Metal/YBCO Plates……Page 96
4.5.3 Explosive Compaction of Axisymmetric Metal/YBCO Billets……Page 112
4.5.4 Thermal Treatment of Explosively Compacted YBCO Billets……Page 126
PRE-HEAT TREATED EXPLOSIVELY COMPACTED CERAMIC BILLETS……Page 127
POST-HEAT TREATED EXPLOSIVELY COMPACTED CERAMIC BILLETS……Page 133
4.5.5 Compaction/Cladding of Metal/BSCCO Plates……Page 135
4.6 REFERENCES……Page 144
5.1 NOTATION……Page 148
5.2 GENERAL……Page 149
PLASTIC DEFORMATION AND FRACTURE……Page 150
DENSITY AND UNIFORMITY……Page 152
ROLLING……Page 154
EXTRUSION……Page 158
UPSETTING……Page 161
5.4.2 Rolling of Explosively Cladded/Compacted Metal-Sheathed/HTS Multilayer Plates……Page 162
METAL/YBCO STRIPS……Page 164
METAL/BSCCO STRIPS……Page 168
5.5 MANUFACTURING OF RODS AND WIRES……Page 179
MELT-TEXTURING PROCESS……Page 180
COMPOSITE REACTION TEXTURING PROCESS……Page 181
COLD EXTRUSION OF METAL/YBCO RODS……Page 182
WARM-EXTRUSION OF METAUYBCO RODS……Page 188
PROFILE ROLLING OF METAL/YBCO WIRES……Page 193
5.6 FABRICATION OF FORGINGS……Page 199
5.7 REFERENCES……Page 201
6.2 HTS THIN-FILM PROCESSING……Page 204
6.2.1 Sputtering……Page 205
6.2.4 Laser Ablation……Page 206
6.2.5 Chemical Vapor Deposition (CVD)……Page 207
6.3.1 Screen Printing……Page 209
6.3.4 Plasma-Spraying……Page 210
6.3.5 Fabrication of Thick Coatings by Plasma-Spraying and Excimer Laser Post-treatment……Page 212
6.4 REFERENCES……Page 218
OPTICAL MICROSCOPY……Page 220
SCANNING ELECTRON MICROSCOPY (SEM)……Page 221
FIELD ION MICROSCOPY (FIM)……Page 222
ENERGY DISPERSIVE X-RAY ANALYSIS (EDAX)……Page 223
X-RAY DIFFRACTION (XRD)……Page 224
ELECTRON DIFFRACTION……Page 225
MÖSSBAUER SPECTROSCOPY……Page 226
DIFFERENTIAL SCANNING CALORIMETRY (DSC)……Page 227
RESISTIVITY MEASUREMENTS……Page 228
DC-MAGNETIZATION MEASUREMENTS……Page 229
MAGNETO-OPTIC IMAGING……Page 230
7.4 REFERENCES……Page 231
8.1 GENERAL……Page 232
8.2.2 Synchronous Generator……Page 235
8.2.3 Levitated Bearing……Page 237
8.2.4 Levitated Vehicle……Page 238
DETERMINATION OF THE MAGNETIC LEVITATION……Page 239
COIL FABRICATION……Page 241
8.3.3 Magnetic Resonance Imaging (MRI)……Page 242
8.3.4 Magnetic Separation……Page 243
8.3.6 Generators……Page 244
8.3.8 Particle Accelerators……Page 245
8.4.1 Josephson Junctions……Page 247
8.4.3 Microwave Antennas……Page 249
8.4.4 Radiation Detectors……Page 251
COMPUTER GATES……Page 252
8.5 REFERENCES……Page 253
9.1.2 A1-xBxCuO2 Compounds……Page 256
9.1.3 Sr-Cu-O Compounds……Page 257
MAGNETOCARDIOGRAPHY USING HIGH-TC SQUIDS……Page 258
DYE/SUPERCONDUCTOR ELECTRONIC SENSORS……Page 259
9.2 SUPERCONDUCTIVITY AT ROOM TEMPERATURE: REALITY OR DREAM?……Page 260
9.3 REFERENCES……Page 261