Materials for Electronic Packaging

Deborah Chung0750693142, 9780750693141, 9780080511177

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors. Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science. Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems.

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Table of contents :
Front Cover……Page 1
Materials for Electronic Packaging……Page 4
Copyright Page……Page 5
Contents……Page 6
Contributors……Page 12
Preface……Page 14
Part I: Overview……Page 16
1.1 Introduction……Page 18
1.2 Printed Circuit Boards……Page 31
1.3 Substrates……Page 34
1.4 Interconnections……Page 42
1.5 Die Attach……Page 45
1.6 Encapsulation……Page 46
1.7 Interlayer Dielectrics……Page 48
1.8 Heat Sinks……Page 49
1.9 Electromagnetic Interference Shielding……Page 50
References……Page 51
Part II: Joining……Page 56
2.1 Introduction……Page 58
2.2 Background……Page 59
2.3 A Microscopic Mass Transfer Model……Page 63
2.4 Observations of Limiting Mass Transfer……Page 65
2.5 Solder Alloy Selection and Process Design……Page 69
2.6 Conclusion……Page 70
References……Page 71
3.1 Introduction……Page 72
3.2 Test Methodology and Data Analysis……Page 73
3.3 Deformation Behaviour of Pb–Sn Solders under Static and Cyclic Loading……Page 79
3.5 Lifetime Predictive Equation for Pb–Sn Solders……Page 85
Acknowledgment……Page 90
References……Page 91
4.1 Introduction……Page 94
4.2 Fluxless Laser Soldering……Page 96
4.3 Activated Acid Vapor Fluxless Soldering……Page 101
4.4 Laser Ablative Fluxless Soldering……Page 108
4.5 Summary and Examples……Page 116
Acknowledgments……Page 117
References……Page 118
5.1 Introduction……Page 120
5.2 Fracture Behavior……Page 122
5.3 Grain Distributions in the Metal Layer……Page 125
5.4 The Interface Pore Distribution……Page 130
5.5 Interface Roughness……Page 134
References……Page 138
Part III: Composites……Page 140
6.1 Introduction……Page 142
6.2 Status of Composite Packaging Materials……Page 143
6.3 Applications……Page 150
6.4 Future Directions……Page 154
References……Page 157
7.1 Introduction……Page 160
7.2 Heat Sinks, Backboards, and Substrates……Page 162
7.3 Brazes and Solders……Page 164
7.4 Die Attach……Page 165
References……Page 167
8.1 Introduction……Page 168
8.2 Particles as the Filler……Page 170
8.3 Flakes and Fibers as Fillers……Page 171
8.4 Three-Dimensional Networks as Fillers……Page 176
8.6 Effect of the Polymer Viscosity……Page 179
8.7 z-Axis Conductors……Page 180
8.8 Electrically Insulating but Thermally Conducting Composites……Page 183
8.9 Conclusion……Page 184
References……Page 185
Part IV: Metal Films……Page 188
9.2 Overview of Materials and Processes……Page 190
9.3 Resistors……Page 193
9.4 Conductors……Page 200
9.5 Dielectrics……Page 209
9.6 Vehicles……Page 214
9.7 Thick Film Processing……Page 217
9.8 Conclusion……Page 235
10.1 Introduction……Page 236
10.2 Electroless Copper Deposition……Page 239
10.3 Copper Nanoline Processing……Page 242
10.4 Electrical Properties……Page 248
10.5 Electroless Copper Oxidation……Page 250
10.6 Hydrogen in Electroless Copper……Page 251
Acknowledgments……Page 254
References……Page 255
11.2 Vacuum Processes……Page 256
11.3 Coating Vessels……Page 261
11.4 Physical Vapor Deposition by Evaporation……Page 262
11.5 Evaporation Methods and Sources……Page 266
11.6 Sputtering……Page 269
11.7 Heat Transfer in Physical Vapor Deposition Processes……Page 278
11.8 Roll Coater Metallization……Page 280
11.9 Coating Material Properties……Page 281
11.10 Evaluating Deposited Films……Page 282
11.11 Conclusions……Page 291
References……Page 292
Part V: Polymers and Other Materials……Page 294
12.2 Why Do Devices Need Encapsulation?……Page 296
12.3 General Chemistry of Silicones (Elastomers and Gels)……Page 299
12.4 Results and Discussion……Page 301
12.6 Temperature Cycle Testing……Page 303
References……Page 304
13.1 Introduction……Page 306
13.2 Experimental……Page 307
13.3 Results and Discussion……Page 310
13.4 Summary……Page 315
References……Page 316
14.1 Introduction……Page 318
14.2 Organic Conductors and Superconductors……Page 320
14.3 Conducting Polymers……Page 327
14.4 Potential Applications of Conducting Polymers……Page 329
References……Page 330
15.2 Background on Diamond……Page 334
15.3 Chemical Vapor Deposition of Diamond……Page 336
15.4 Fabrication of Electronic Substrates……Page 346
15.5 Package Design Considerations……Page 348
References……Page 350
Part Vl: Materials Testing……Page 354
16.1 Introduction……Page 356
16.2 Electrical Properties……Page 359
16.3 Thermal Properties……Page 361
16.4 Mechanical Properties……Page 367
16.6 Manufacturability Properties……Page 370
16.7 Summary……Page 371
References……Page 372
Index……Page 376