Electrochemistry of Semiconductors and Electronics: Processes and Devices

John Dr McHardy, Frank Haber, John Dr McHardy, Frank Haber9780815513018, 0-8155-1301-1

This is an in-depth review, by eight respected researchers of the electrochemistry of semiconductors and electronics. The book covers possible electrochemical avenues towards the goals of achieving greater semiconductor purity, crystal uniformity, and circuit density, and thus, faster more compact electronic devices.

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Table of contents :
Table of Contents……Page 0
Front Matter……Page 1
Preface……Page 7
Table of Contents……Page 9
1.0 Introduction……Page 14
2.0 Theory……Page 16
Introduction……Page 21
Silicate-Based Melts……Page 22
Fluorosilicate-Based Melts……Page 27
Organic Electrolytes……Page 28
Aqueous Solvents……Page 29
Non-Aqueous Solvents……Page 37
Ternary Alloys and Compounds……Page 43
Gallium Phosphide……Page 47
Indium Phosphide……Page 52
Silicon Carbide……Page 57
5.0 Conclusion……Page 60
6.0 References……Page 61
1.0 Introduction……Page 66
2.1 Driving Force for Dissolution: Some Basic Concepts and Definitions……Page 67
2.2 Dissolution Process Controlled by Surface Reactions and Volume Diffusion……Page 69
2.3 Types of Dissolution……Page 71
Dissolution of Ionic Compounds in Aqueous Solutions……Page 72
Dissolution of Ionic Crystals in Acidic and Alkaline Media……Page 73
Dissolution of Metals……Page 75
Dissolution of Semiconductors……Page 78
2.5 Dissolution Kinetics in Terms of Surface Adsorption Layers……Page 85
Two-Dimensional Nucleation Models……Page 86
Surface Diffusion Model……Page 88
3.0 Mechanism of Selective Etching……Page 89
3.1 Models of Etch-Pit Formation……Page 90
3.2 The Slope of Dislocation Etch Pits……Page 94
3.3 The Role of Impurities……Page 95
Water-Soluble Crystals……Page 102
4.3 Metallic Crystals……Page 103
4.4 Semiconductors……Page 105
5.0 Photoetching……Page 110
6.0 Electrolytic Etching and Polishing……Page 112
7.0 Gas-Phase Chemical Etching……Page 115
8.0 Morphology of Chemical Etch Pits……Page 119
9.0 Correspondence Between Etch Figures and Dislocations……Page 124
10.0 Etching Profiles……Page 126
11.0 Acknowledgement……Page 130
12.0 References……Page 133
1.1 Types of Infrared Detectors……Page 141
MIS Devices……Page 142
Photovoltaic Devices……Page 147
Material Effects……Page 151
Surface Preparation……Page 153
2.0 Anodic Oxidation……Page 155
2.1 Oxide Composition-Phase Diagrams……Page 156
2.2 Oxide Analyses……Page 158
2.3 Chemical Processes……Page 163
3.1 Electrochemical……Page 179
3.2 Non-Electrochemical Passivation……Page 182
4.0 References……Page 183
1.0 Introduction……Page 191
2.0 Experimental Procedures……Page 192
3.1 General Background……Page 196
Holographic Gratings……Page 201
Non-Holographic Periodic Structures……Page 206
3.3 Focused Laser and Related Techniques……Page 211
3.4 Miscellaneous Applications of Photoelectrochemical Etching……Page 215
4.0 Photoelectrochemical Deposition……Page 218
5.0 Photoelectrochemical Surface Processing……Page 224
7.0 Acknowledgement……Page 226
8.0 References……Page 227
1.0 Introduction……Page 232
2.0 Direct Response……Page 234
2.2 Rotating Ring Disc Electrodes……Page 235
2.3 Absorption, Reflection and Photoluminescence Spectroscopies……Page 237
3.0 Electric Field Modulation of System’s Response……Page 239
3.1 Impedance……Page 240
3.3 Optical Techniques……Page 247
Electroreflectance……Page 249
Photoreflectance……Page 250
Electromodulated Infrared Spectroscopy……Page 255
4.0 Time Resolved Techniques……Page 256
4.2 Potential……Page 257
4.5 Surface Restricted Transient Grating……Page 258
5.0 Photothermal Methods……Page 259
7.0 Acknowledgement……Page 260
8.0 References……Page 262
1.0 Introduction……Page 270
2.1 Current Density Through an Electrolyte……Page 275
Water Availability as a Function of RH……Page 276
B.E.T. RH – Function……Page 277
RH Function Based on Pore Distribution……Page 278
tf for Dendrites Based on Pore Distribution……Page 279
2.2 Current Density Through a Polymer Coating……Page 280
3.1 Parameters for Dendrite Model……Page 281
3.2 Parameters for Leakage Model……Page 288
Ag, Pb, and Cu Films……Page 291
Ni Films……Page 293
Cu-15% Ag-2.5% P Wires……Page 296
4.1 Model Acceleration and Materials/Process Effects……Page 298
4.2 Materials Characterization by Water-Drop……Page 301
4.3 Effect of Active Impurities……Page 302
4.4 Mechanism and Time-to-Failure Results……Page 303
4.5 Polymer Coating……Page 305
5.0 Summary……Page 306
6.0 Acknowledgement……Page 308
7.0 References……Page 309
1.0 Introduction……Page 312
2.1 Double-Layer Capacitors……Page 315
2.2 Electrosorption Capacitance……Page 317
2.3 Surface Redox Processes……Page 321
2.4 Thin-Film Bulk Reaction……Page 323
3.1 General Considerations……Page 326
3.2 Uniform Transmission Line Model of the Response of Porous Electrodes……Page 327
3.3 Rough Electrode Surfaces……Page 330
3.4 Nonuniform Pores……Page 332
3.5 Mass Transport into a Thin Film……Page 335
3.6 Large-Signal Response……Page 336
4.1 Introduction……Page 337
4.2 Systems with Aqueous Electrolytes……Page 339
4.3 Nonaqueous Electrolyte Systems……Page 341
4.4 Solid Electrolyte Systems……Page 345
5.1 Introduction……Page 347
5.2 Thermally Prepared Oxide Films……Page 348
5.3 Anodically Prepared Films……Page 352
5.4 Other Oxides……Page 355
6.1 Introduction……Page 356
6.2 Charge-Storage Mechanism……Page 357
7.0 Conclusions……Page 358
8.0 Acknowledgements……Page 363
9.0 References……Page 364
Index……Page 372