Reliability of MEMS Testing of Materials and Devices

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ISBN: 978-3-527-30536-0, 978-3-527-30746-3, 978-3-527-30998-6, 978-3-527-31080-7

Size: 5 MB (5509187 bytes)

Pages: 326/326

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Osamu Tabata, Toshiyuki Tsuchiya, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink978-3-527-30536-0, 978-3-527-30746-3, 978-3-527-30998-6, 978-3-527-31080-7


Table of contents :
Reliability of MEMS……Page 4
Preface……Page 8
Foreword (by Series Editors)……Page 10
Contents……Page 12
List of Contributors……Page 14
Overview: Introduction to MEMS Reliability……Page 16
1 Evaluation of Mechanical Properties of MEMS Materials and Their Standardization……Page 24
2 Elastoplastic Indentation Contact Mechanics of Homogeneous Materials and Coating–Substrate Systems……Page 50
3 Thin-film Characterization Using the Bulge Test……Page 90
4 Uniaxial Tensile Test for MEMS Materials……Page 146
5 On-chip Testing of MEMS……Page 186
6 Reliability of a Capacitive Pressure Sensor……Page 208
7 Inertial Sensors……Page 228
8 High-accuracy, High-reliability MEMS Accelerometer……Page 248
9 Reliability of MEMS Variable Optical Attenuator……Page 262
10 Eco Scan MEMS Resonant Mirror……Page 290
Index……Page 314

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