Practical guide to the packaging of electronics: thermal and mechanical design and analysis

Ali Jamnia9780824708658, 0-8247-0865-2

Emphasizes reliability problems and the design of systems with incomplete criteria and components. Provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.

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Table of contents :
PRACTICAL GUIDE TO THE PACKAGING OF ELECTRONICS……Page 1
PREFACE……Page 4
ACKNOWLEDGMENTS……Page 5
CHAPTER 3. CONDUCTIVE COOLING……Page 6
CHAPTER 7. INTRODUCTION TO FINITE ELEMENT METHOD……Page 7
REFERENCES……Page 8
CONTENTS……Page 0
ISSUES IN ELECTRONICS PACKAGING DESIGN……Page 9
PACKAGING/ENCLOSURE DESIGN……Page 10
RELIABILITY……Page 11
BASIC EQUATIONS AND CONCEPTS……Page 12
GENERAL EQUATIONS……Page 13
GRASHOF NUMBER……Page 14
REYNOLDS NUMBER……Page 15
CHAPTER 3 CONDUCTIVE COOLING……Page 16
SAMPLE PROBLEM AND CALCULATIONS……Page 17
SAMPLE PROBLEM AND CALCULATIONS……Page 18
TEMPERATURE AT INTERMEDIATE POINTS……Page 21
EXERCISE: 1C TEMPERATURE DETERMINATION……Page 22
HEAT SPREADING……Page 25
EXAMPLE……Page 26
JUNCTION-TO-CASE RESISTANCE……Page 27
MODELING THE INTERFACE……Page 28
EXERCISE – CALCULATE THE COMPONENT TEMPERATURE……Page 29
A SECOND APPROACH……Page 31
A THIRD APPROACH……Page 32
2-D OR 3-D HEAT CONDUCTION……Page 34
FACTORS INFLUENCING RADIATION……Page 39
SURFACE PROPERTIES……Page 40
VIEW FACTOR CALCULATIONS……Page 41
ELECTRONICS PACKAGING PROBLEM……Page 43
FLOW IN A VERTICAL OPEN-ENDED CHANNEL……Page 48
CABINET SURFACE TEMPERATURE……Page 49
CHAPTER 5 FUNDAMENTALS OF CONVECTIVE COOLING……Page 51
FLOW REGIMES, TYPES AND INFLUENCES……Page 53
FREE (OR NATURAL) CONVECTION……Page 54
ESTIMATES OF HEAT TRANSFER COEFFICIENT……Page 55
APPROACH 2……Page 58
DESIGN TIPS……Page 61
CABINET INTERIOR AND SURFACE TEMPERATURE……Page 62
HEAT BALANCE……Page 63
BASIC PROCEDURE……Page 66
CALCULATION OF INTERNAL TEMPERATURE……Page 67
FIN DESIGN……Page 69
FORCED CONVECTION……Page 70
THE REQUIRED FLOW RATE……Page 72
BOARD SPACING AND CONFIGURATIONS……Page 75
ELEMENTS IN PARALLEL:……Page 77
SYSTEM’S IMPEDANCE CURVE……Page 79
FAN SELECTION AND FAN LAWS……Page 83
COMPONENT HOT SPOT……Page 86
INDIRECT FLOW SYSTEM DESIGN……Page 90
RESISTANCE NETWORK REPRESENTATION……Page 91
CHAPTER 6 BASICS OF SHOCK AND VIBRATION……Page 93
HARMONIC MOTION……Page 94
VIBRATION TERMINOLOGY……Page 95
FREE VIBRATION……Page 97
FIRST APPLICATION……Page 98
SECOND APPLICATION……Page 101
MODE SHAPES……Page 102
IMPACT OF DAMPING……Page 104
FORCED VIBRATION……Page 106
SAMPLE PROBLEM……Page 109
EXAMPLE 1……Page 111
EXAMPLE 2……Page 112
A PULSE SHOCK ISOLATION EXAMPLE……Page 116
A VELOCITY SHOCK ISOLATION EXAMPLE……Page 119
INDUCED STRESSES……Page 122
RANDOM VIBRATION……Page 125
EXCITATION SPECTRUM……Page 126
EQUIPMENT RESPONSE……Page 129
DYNAMIC LOADS……Page 130
EXERCISE……Page 131
CHAPTER 7 INTRODUCTION TO FINITE ELEMENT METHOD……Page 134
AN EXAMPLE OF FINITE ELEMENT FORMULATION……Page 135
FORMULATION OF CHARACTERISTIC MATRIX AND LOAD VECTOR……Page 138
WAVE PROPAGATION TYPE……Page 143
VIBRATION TYPE……Page 145
CONSISTENT MASS MATRIX……Page 146
LUMPED MASS MATRIX……Page 148
LUMPED FORMULATION……Page 149
FINITE ELEMENT FORMULATION OF HEAT CONDUCTION……Page 151
SOME BASIC DEFINITIONS……Page 153
THE FINITE ELEMENT ANALYSIS PROCEDURE……Page 154
CHAPTER 8 DESIGN AND ANALYSIS FOR MECHANICALLY RELIABLE SYSTEMS……Page 156
STRESS ANALYSIS……Page 157
ISOTROPIC BEHAVIOR……Page 160
SIMPLIFICATION OR ENGINEERING ASSUMPTIONS……Page 163
FAILURE……Page 166
FAILURE BY FRACTURE……Page 167
FAILURE BY ELASTIC DEFLECTION……Page 168
FAILURE BY FATIGUE……Page 169
LIFE EXPECTANCY……Page 170
THERMAL STRESSES AND STRAINS……Page 171
PCB WARPAGE……Page 173
SOME TIPS……Page 174
CHAPTER 9 ELECTRICAL RELIABILITY……Page 175
FIRST-YEAR FAILURES……Page 176
RELIABILITY MODELS……Page 177
SYSTEM FAILURE RATE……Page 180
CAD TO FEA CONSIDERATIONS……Page 184
CRITERIA FOR CHOOSING AN ENGINEERING SOFTWARE……Page 185
SOLID MECHANICS AND STRESS ANALYSIS – FEA SOFTWARE……Page 186
GENERAL PHYSICS – CFD AND/OR FEA……Page 187
COMPLETE PACKAGE……Page 188
CUSTOMER SUPPORT……Page 189
QUALITY ASSURANCE (QA)……Page 190
INTERFACING TO OTHER PROGRAMS……Page 192
CHAPTER 11 DESIGN CONSIDERATIONS IN AN AVIONICS ELECTRONIC PACKAGE……Page 194
OPERATIONAL CHARACTERISTICS……Page 195
ELECTRICAL DESIGN SPECIFICATIONS……Page 196
MECHANICAL DESIGN SPECIFICATIONS……Page 197
ANALYSIS……Page 198
THERMAL ANALYSIS……Page 199
LOAD CARRYING AND VIBRATION ANALYSIS……Page 200
RELIABILITY AND MTBF CALCULATIONS……Page 204
REFERENCES……Page 206