Leszek Wojnar0849382262, 9780849382260
Table of contents :
Image Analysis: Applications in Materials Engineering……Page 1
Preface……Page 4
The Author……Page 6
Acknowledgments……Page 7
Contents……Page 8
1.1 Digital images and their analysis versus the human vision system……Page 10
Table of Contents……Page 0
1.2 General concept of the book……Page 14
2.1 About this chapter……Page 16
2.2 Basic image enhancement……Page 17
2.3 Filters……Page 23
2.4 Binarization……Page 30
2.5 Mathematical morphology……Page 38
2.6 Fourier transformation……Page 49
2.7 Edge detection……Page 53
2.8 Combining two images……Page 59
2.9 Mouse etching……Page 62
Image Analysis: Applications in Materials Engineering……Page 88
3.1 Specimen preparation……Page 64
3.2 Image acquisition……Page 70
3.3 Shade correction……Page 76
3.4 Removing artifacts……Page 82
3.5 Basic tips……Page 86
4.1 Grain boundaries……Page 89
Example 1. Grains in a model alloy used for machinability tests……Page 94
Example 2. Restoration of grain boundaries in the QE 22 alloy after high-temperature homogenization……Page 96
Example 3. Grains in a polystyrene foam (a rather difficult case)……Page 100
Example 4. Grains of a clean, single phase material……Page 104
Example 5. Grains in a CeO2 ceramic……Page 109
Example 6. WC-Co cermet……Page 117
Example 7. Grains in a high-speed steel…….Page 119
Example 8. A tricky solution to a nearly hopeless case……Page 123
4.2 Other features detected like grains……Page 128
4.3 Pores and isolated particles……Page 131
4.4. Chains and colonies……Page 136
4.5 Fibers……Page 149
5.1 Textured and oriented structures……Page 160
5.2 Very fine structures……Page 170
5.3 Fracture surfaces……Page 173
6.1 Image processing and image analysis……Page 186
6.2 Measurements of single particles……Page 188
6.3 First measurements – numbers……Page 195
6.4 Shape……Page 200
6.5 Grain size……Page 208
6.6 Gray-scale measurements……Page 214
6.7 Other measurements……Page 215
7.1 Quality and routine control……Page 219
7.2 Simulation……Page 222
7.3 Research and case histories……Page 225
7.4 Concluding remarks……Page 231
References……Page 233
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