Fundamentals of Microsystems Packaging

Rao Tummala9780071371698, 0071371699

The only book to teach microsystems packaging-written by the field’s leading authorThis is the book that engineers, technicians, and students want-the first to teach microsystems packaging from the ground up. Rao Tummala’s one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It’s the only book to do so. This much-needed tool features:*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology*Easy-to-read schematics and block diagrams*Fundamental approaches to all system issues*Examples of all common configurations and technologies-wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes*Basics of electrical and reliability testing*Hundreds of explanatory two-color illustrations*Self-test problems and solutions in every chapter*Glossary*The best way to learn microsystems packaging through self-study or in a classroom-and the most comprehensive on-the-job reference