Adhesion Aspects of Thin Films

Mittal K. L.978-90-6764-455-6

A second international symposium on adhesion aspects of thin films, held in Orlando, Florida in December 2003, expanded from the first by considering metalized plastics and adhesion measurement. The 17 papers that stuck to the publishing process clear to the end consider such topics as adhesion properties of functionally gradient diamond- like carbon nano-composite films, characterizing polyethylene-metal composite thin films deposited by evaporation, the contribution of chemical reactions between aluminum atoms and different types of functional groups to the adhesion of aluminum-polymer systems, and two critical events observed on copper films on glass substrate in the micro-scratch test. There is no index. VSP is a subsidiary of Brill.